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Quaker Chemical Corporation
 
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Electronics Industry
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Related Information

Applications


  • Module Potting and Encapsulant Compounds
    SS1920
Products

SS1874

A clear, two component room temperature curing epoxy compound with excellent electrical and physical properties.

SS1919

High performance/clarity, low viscosity, 100% solids filter fiberglassing epoxy systems. FDA 175.105 approved.

SS2017

A two component, unfilled, 100% solids polyurethane potting and casting compound. Specifically developed for telecommunications connector blocks.

SS1803

A black, low viscosity, two component electronic grade potting compound. Excellent physical and electrical characteristics with a high gloss surface appearance. Easy handling. Ideal for the encapsulation of electronic modules.

SS1804

A black filled, two component room temperature curing epoxy. Excellent physical and electrical characteristics with a high gloss surface appearance. Easy handling. Self de-airation.

SS1836X

A black, two component flame retardant filled epoxy. Excellent thermal properties, low shrinkage and lower coefficient of thermal expansion. Developed for the potting of electronic modules. UL Listed 94VO.

SS1873

A two component filled epoxy compound. Exhibits outstanding tensile strength. Crack resistant under extreme conditions.

SS1875

A two component filled epoxy compound developed specifically for the potting of electrical and electronic modules. Excellent thermal properties. Low shrinkage and lower coefficient of thermal expansion.

SS1920

A white, heat cure, two component epoxy developed for the potting and encapsulation of electronic components and circuitry. Formulated for the flyback transformer market. UL Listed 94V0. Contains no halogens or antimony oxide and flame retardant.